Oxide films on the metal surface in the presence of dissolved oxygen in the organic solvent interact with the dissolved ligand to form a complex compound. The effect of preliminary treatment of the copper surface on the interaction with a ligand of salicyl alanine and α-benzoinoxime in a non-aqueous solvent of dimethylformamide and methylpyrrolidone is considered. The ligand concentration is 0.01 mol / l. The surface treatment of copper was carried out in a 12% solution of hydrochloric acid; by electrochemical deposition of copper on a copper substrate; treatment with 10% nitric acid solution; electrochemical polishing; The untreated surface of copper (spontaneous oxide and hydrocarbonate films) was used; chemical polishing; mechanical restoration; treatment with 30% and 68% nitric acid solution. The highest rate of dissolution is characteristic for samples pretreated with 12% (3,6 M) hydrochloric acid, as well as for samples whose surface was formed by electrolytic precipitation of copper from an acid solution of copper sulfate.